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revisions ltr description date (yr - mo - da) approved rev sheet rev sheet 15 rev status rev of sheets s heet 1 2 3 4 5 6 7 8 9 10 11 12 13 14 pmic n/a prepared by phu h. nguyen defense supply center columbus standard microcircuit drawing checked by phu h. nguyen columbus, ohio 43216 http://www.dscc.dla.mil this drawing is available for use by all departments approved by thomas m. hess and agencies of the department of defense drawing approval date 03 - 08 - 11 microcircuit, digital, cmos gate array based on can asic space application (casa2), monolithic silicon amsc n/a revision level size a cage code 67268 5962 - 03a06 sheet 1 of 15 dscc form 2233 apr 97 5962 - e426 - 03 distribution statement a . approved for public release; distribution is unlimited.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 2 dscc form 2234 apr 97 1 . scope 1.1 scope . this drawing documents two product assurance class levels consisting of high reliability (device classes q and m) and space application (device class v). a choice of case outlines and lead finishes are available and are reflected in the part or identifying number (pin). when available, a choice of radiation hardness assurance (rha) levels are reflected in the pin. 1.2 pin . the pin is as shown in the following example: 5962 - 03a06 01 q x c federal stock class designator rha designator (see 1.2.1) device type (see 1.2.2) device class designator case outline (see 1.2.4) lead finish (see 1.2.5) \ / (see 1.2.3) \ / drawing number 1.2.1 rha designator . device classes q and v rha marked devices meet the mil - prf - 38535 specified rha levels and are marked with the appropriate rha designator. device class m rha marked devices me et the mil - prf - 38535, appendix a specified rha levels and are marked with the appropriate rha designator. a dash ( - ) indicates a non - rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic nu mber circuit function 01 AT7908E can asic space application 1.2.3 device class designator . the device class designator is a single letter identifying the product assurance level as follows: device class device requirements documentation m vendor self - certification to the requirements for mil - std - 883 compliant, non - jan class level b microcircuits in accordance with mil - prf - 38535, appendix a q or v certification and qualification to mil - prf - 38535 1.2.4 case outline(s) . the case outline(s) are a s designated in mil - std - 1835 and as follows: outline letter descriptive designator terminals package style x see figure 1 44 multilayer ceramic package 1.2.5 lead finish . the lead finish is as specified in mil - prf - 38535 for device classes q and v o r mil - prf - 38535, appendix a for device class m.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 3 dscc form 2234 apr 97 1.3 absolute maximum ratings . 1 / supply voltage range (v dd ) ................................ ................................ .................. - 0.5 v to 6.0 v 2 / input voltage range (v in ) ................................ ................................ .................... - 0.5 v to v dd + 0.5 v 3 / storage temperature range ................................ ................................ ............... - 65 o c to +150 o c lead temperatur e ................................ ................................ ................................ +300 o c 4 / maximum junction temperature (t j ) ................................ ................................ .. +175 o c maximum power dissipation (p d ) ................................ ................................ ...... 0.3 w thermal resistance, junction - to - case ( q jc ) ................................ ...................... 5.1 o c/w 1.4 recommended operating conditions . supply voltage range (v dd ) ................................ ................................ ................. 4.5 v to 5.5 v ambient temperature (t a ) ................................ ................................ .................... - 55 o c to 125 o c storage conditions ................................ ................................ .............................. 30 o c, 20 to 65% rh, dust free, original packing 2. applicable documents 2.1 government sp ecification, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of these documents are those listed in the issue of the depart ment of defense index of specifications and standards (dodiss) and supplement thereto, cited in the solicitation. specification department of defense mil - prf - 38535 - integrated circuits, manufacturing, general specification for. standards department of defense mil - std - 883 - test method standard microcircuits. mil - std - 1835 - interface standard electronic component case outlines. handbooks department of defense mil - hdbk - 103 - list of standard microcircuit drawings. mil - hdbk - 780 - standard microcircuit drawings. (unless otherwise indicated, copies of the specification, standards, and handbooks are available from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111 - 5094.) 2.2 or der of precedence . in the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exe mption has been obtained. _______ 1 / stresses above the absolute maximum rating may cause permanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability. 2 / all voltages referenced to ground unless otherwise specified. 3 / v dd + 0.5 v shall not exceed 6.0 v. 4 / duration 10 second maximum at a distance not less than 1.6 mm.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 4 dscc form 2234 apr 97 3. requirements 3.1 item requirements . the individual item requirements for device classes q and v sh all be in accordance with mil - prf - 38535 and as specified herein or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. the individual ite m requirements for device class m shall be in accordance with mil - prf - 38535, appendix a for non - jan class level b devices and as specified herein. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions shal l be as specified in mil - prf - 38535 and herein for device classes q and v or mil - prf - 38535, appendix a and herein for device class m. 3.2.1 case outline the case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 2. 3.2.3 block or logic diagram . the block or logic diagram shall be as specified on figure 3. 3.2.4 timing waveforms . the timing waveforms shall be specified on figure 4. 3.3 electrical p erformance characteristics and postirradiation parameter limits . unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table i and shall apply over the full ambient operating temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the subgroups specified in table ii. the electrical tests for each subgroup are defined in table i. 3.5 marking . the part shall be marked with the pin listed in 1.2 herein. in addition, the manufacturer's pin may also be marked as listed in mil - hdbk - 103. for packages where marking of the entire smd pin number is not feasible due to space limitations, the manufacturer has the option of not marking the " 5962 - " on the device. for rha product using this option, the rha designator shall still be marked. marking for device classes q and v shall be in accordance with mil - prf - 38535. marking for device class m shall be in accordance with mil - prf - 38535, append ix a. 3.5.1 certification/compliance mark . the certification mark for device classes q and v shall be a "qml" or "q" as required in mil - prf - 38535. the compliance mark for device class m shall be a "c" as required in mil - prf - 38535, appendix a. 3.6 certifi cate of compliance . for device classes q and v, a certificate of compliance shall be required from a qml - 38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). for device class m, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in mil - hdbk - 103 (see 6.6.2 herein). the certificate of compliance submitted to dscc - va prior to listing as an approved source of supply for this drawing shall affi rm that the manufacturer's product meets, for device classes q and v, the requirements of mil - prf - 38535 and herein or for device class m, the requirements of mil - prf - 38535, appendix a and herein. 3.7 certificate of conformance . a certificate of conform ance as required for device classes q and v in mil - prf - 38535 or for device class m in mil - prf - 38535, appendix a shall be provided with each lot of microcircuits delivered to this drawing. 3.8 notification of change for device class m . for device class m, notification to dscc - va of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in mil - prf - 38535, appendix a. 3.9 verification and review for device class m . for device class m, dscc, ds cc's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. offshore documentation shall be made available onshore at the option of the reviewer. 3.10 microcircuit group assignment for device class m . device class m devices covered by this drawing shall be in microcircuit group number 123 (see mil - prf - 38535, appendix a).
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 5 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions - 55 c t a +125 c group a subgr oups limits units unless otherwise specified min. max. input clamp voltage to ground 1/ v ic i oh = - 300 a 1, 2, 3 - 1.2 - 0.2 v low level input current 2/ i il v in = gnd, v dd = 5.5 v 1, 2, 3 - 5 a low level input current, pull - up 2 / i ilpu v in = gnd, v dd = 5.5 v 1, 2, 3 - 100 a low level input current, pull - down 2 / i llpd v in = gnd, v dd = 5.5 v 1, 2, 3 - 5 a high level input current 2 / i ih v in = v dd = 5.5 v 1, 2, 3 5 a high level input current, pull - up 2 / i ihpu v in = v dd = 5.5 v 1, 2, 3 5 a high level input current, pull - down 2 / i ihpd v in = v dd = 5.5 v 1, 2, 3 300 a output leakage low current 2 / i ozl v out = gnd, outputs disabled 1, 2, 3 - 5 a output leakage high current, pull - down output 2 / i oz hpd v out = v dd, outputs disabled 1, 2, 3 300 a output leakage low current, pull - up output 2 / i ozlpu v out = gnd, outputs disabled 1, 2, 3 - 100 a output leakage high current 2 / i ozh v out = v dd, outputs disabled 1, 2, 3 5 a low level output voltage, bout12 2 / v ol1 v dd = 4.5 v, i ol = +12 ma 1, 2, 3 0.4 v low level output voltage, bout6 2 / v ol2 v dd = 4.5 v, i ol = +6 ma 1, 2, 3 0.4 v low level output voltage, bout3 2 / v ol3 v dd = 4.5 v, i ol = +3 ma 1, 2, 3 0.4 v hi gh level output voltage, bout12 2 / v oh1 v dd = 4.5 v, i ol = - 12 ma 1, 2, 3 3.9 v high level output voltage, bout6 2 / v oh2 v dd = 4.5 v, i ol = - 6 ma 1, 2, 3 3.9 v high level output voltage, bout3 2 / v oh3 v dd = 4.5 v, i ol = - 3 ma 1, 2, 3 3. 9 v low level input voltage 1 / v il functional verification 1, 2, 3 0.3 v dd v high level input voltage 1 / v ih functional verification 1, 2, 3 0.7 v dd v input capacitance 3 / c i v dd = 0 v 4 15 pf output capacitance 3 / c io v dd = 0 v 4 15 pf supply current stand by for array 2 / i ddsba v da = 5.5v 1, 2, 3 50 a supply current operating for array 2 / i ddopa v da = 5.5v 4, 5, 6 25 ma supply current operating for buffer 2 / i ddopb v db = 5.5v 4, 5, 6 10 ma see notes at end of tabl e.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics - continued. test symbol conditions - 55 c t a +125 c group a subgroups limits units unless otherwise specified min. max. address valid to ale low 2 / t avll 9, 10, 11 4 ns address hold after ale low 2 / t llax 9, 10, 11 4 ale high time t lhll 9, 10, 11 100 ale low to rd low t llrl 9, 10, 11 200 cs high to rd low 2 / t chrl 9, 10, 11 100 input data valid to wr hi gh t dvwh 9, 10, 11 300 input data hold after wr high t whqx 9, 10, 11 10 wr pulse width t wlwh 9, 10, 11 300 wr high to next ale high t whlh 9, 10, 11 100 wr setup time before clock 2 / t ws 9, 10, 11 - 3 wr hold time after clock t w h 9, 10, 11 7 rd pulse width t rlrh 9, 10, 11 300 rd low to data valid t rldv 9, 10, 11 6 82 data float after rd high t rhdz v dd = 5v 10%, v ss = 0v, tclk = 100 ns 9, 10, 11 4 20 notes: 1. forcing conditions of the functional test assure that these limits are met but they will no t be individually recorded. 2. read and record measurements in accordance with mil - prf - 38535. 3. tested at initial design and after major process changes, otherwise guaranteed.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 7 dscc form 2234 apr 97 case x millimeters inches symbol min max min max a 2.67 4.95 .105 .195 a1 1.65 nom .065 nom b1 0.33 0.56 .013 .022 b2 0.55 0.88 .022 .035 c1 0.17 0.25 .007 .010 d/e 17.14 17.78 .675 .700 d1/e1 15.74 16.75 .620 .660 e 1.27 bsc .050 bsc e2 16.00 bsc .630 bsc l 0.12 .005 nd/ne 11 11 r 0.50 1.01 .020 .040 j 0.58 .023 figure 1. case outline .
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 8 dscc form 2234 apr 97 case x pin number signal name type note 1 v dda1 power for array 2 addr[4] i input address (mode 1) or output address (mode 0) 3 addr[5] i input address (mode 1) or output address (mod e 0) 4 addr[6] i input address (mode 1) or output address (mode 0) 5 addr[7] i input address (mode 1) or output address (mode 0) 6 v ssb1 ground for periphery 7 v ddb2 power for periphery 8 cs i chip select signal 9 mode i interface operational mode 10 ale i adress latch enable 11 wr i write signal 12 v ssa1 ground for array 13 rd i read signal 14 sena i scan enable 15 test i input signal to increase testability 16 reset i reset signal 17 v ssb2 ground for periphery 18 v ddb3 power for periph ery 19 can_rx i rx signal 20 hasync o output synchronization signal 21 not connected 22 xtalout i/o output from internal oscillator 23 xtalin i input to internal oscillator or clock input from external oscillator 24 v dda2 power for array 25 int o interrupt request 26 hatrig o output signal to trigger the message matching 27 can_tx o tx signal 28 v ssb3 ground for periphery 29 v ddb4 power for periphery 30 data[0] i/o adress data bus figure 2. terminal connections .
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 9 dscc form 2234 apr 97 pin number signal name type note 31 data[1] i/o adress data bus 32 data[2] i/o adress data bus 33 data[3] i/o adress data bus 34 v ssa2 ground for array 35 data[4] i/o adress data bus 36 data[5] i/o adress data bus 37 data[6] i/o adress data bus 38 data[7] i/o adre ss data bus 39 v ssb4 ground for periphery 40 v ddb1 power for periphery 41 addr[0] i input address (mode 1) or output address (mode 0) 42 addr[1] i input address (mode 1) or output address (mode 0) 43 addr[2] i input address (mode 1) or output addres s (mode 0) 44 addr[3] i input address (mode 1) or output address (mode 0) notes: 1. mode : input pin to select operational mode of interface: mode = 0 : 8 bit data bus multiplexed with lowest 8 - bit address(register mapped between 8000hex and 804chex) mode = 1 : 8 bit not multiplexed address data bus ( register mapped between 00 hex and 4c hex) 2. v dda1 = v dda2 = v ddb1 = v ddb2 = v ddb3 = v ddb4 = 5 v 3. v ssa1 = v ssa2 = v ssb1 = v ssb2 = v ssb3 = v ssb4 = 0v 4. i = input, o = output figure 2. terminal conne ctions - continued.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 10 dscc form 2234 apr 97 figure 3. block diagram .
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 11 dscc form 2234 apr 97 figure 4. timing waveforms .
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 12 dscc form 2234 apr 97 4. quality assurance provisions 4.1 sampling and inspection . for device classes q and v, sampling and inspection procedures shall be in accordance with mil - prf - 38535 or as modified in the device manufacturer's quality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. for device class m, sampling and inspection procedures shall be in accordance with mil - prf - 38535, appendix a. 4.2 screening . for device classes q and v, screening shall be in accordance with mil - prf - 38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. for device class m, screening shall be in accordance with method 5004 of mil - std - 883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 addi tional criteria for device class m . a. burn - in test, method 1015 of mil - std - 883. (1) test condition a, b, c, d or e. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the prepar ing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) t a = +125 c, minimum. b. interim and final electrical test parameters shall be as specified in table ii herein. 4.2.2 additional criteria for device classes q and v . a. the burn - in test duration, test condition and test temperature, or approved alternatives sh all be as specified in the device manufacturer's qm plan in accordance with mil - prf - 38535. the burn - in test circuit shall be maintained under document revision level control of the device manufacturer's technology review board (trb) in accordance with mil - prf - 38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of mi l - std - 883. b. interim and final electrical test parameters shall be as specified in table ii herein. c. additional screening for device class v beyond the requirements of device class q shall be as specified in mil - prf - 38535, appendix b. 4.3 qualifi cation inspection for device classes q and v . qualification inspection for device classes q and v shall be in accordance with mil - prf - 38535. inspections to be performed shall be those specified in mil - prf - 38535 and herein for groups a, b, c, d, and e ins pections (see 4.4.1 through 4.4.4). 4.4 conformance inspection . technology conformance inspection for classes q and v shall be in accordance with mil - prf - 38535 including groups a, b, c, d, and e inspections and as specified herein. quality conformanc e inspection for device class m shall be in accordance with mil - prf - 38535, appendix a and as specified herein. inspections to be performed for device class m shall be those specified in method 5005 of mil - std - 883 and herein for groups a, b, c, d, and e in spections (see 4.4.1 through 4.4.4). 4.4.1 group a inspection . a. tests shall be as specified in table ii herein. b. for device class m, subgroups 7 and 8 tests shall be sufficient to verify the functionality of the device. for device classes q and v, subgroups 7 and 8 shall include verifying the functionality of the device; these tests shall have been fault graded in accordance with mil - std - 883, test method 5012.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 13 dscc form 2234 apr 97 table ii. electrical test requirements . test requirements subgroups (in accordance with mil - std - 883, method 5005, table i) subgroups (in accordance with mil - prf - 38535, table iii) device class m device class q device class v interim electrical parameters (see 4.2) 1, 7, 9 1, 7, 9 1, 7, 9 d 1 / final electrical parameters (see 4 .2) 1, 2, 3, 7, 8, 9, 10, 11 2 / 1, 2, 3, 7, 8, 9, 10, 11 2 / 1, 2, 3, 7, 8, 9, 10, 11 3 / group a test requirements (see 4.4) 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 4, 7, 8, 9, 10, 11 1, 2, 3, 4, 7, 8, 9, 10, 11 group c end - point electrical parameter s (see 4.4) 1, 7, 9 1, 2, 3, 7, 8, 9, 10, 11 1, 2, 3, 7, 8, 9, 10, 11 group d end - point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 group e end - point electrical parameters (see 4.4) 1, 7, 9 1, 7, 9 1, 7, 9 1. d indicates delta limits (s ee table iib) shall be required where specified and the delta values shall be computed with reference to previous interim electrical parameters. for device class v, performance of delta limits shall be specified by the manufacturer?s qm plan. 2. pda applie s to subgroups 1. 3. pda applies to subgroups 1 and 7. table iib. delta limits at 25c parameters 1/ all device types i ccsba 5 a v ol /v oh 0.1 v i ozl /i ozh 0.1 a i il /i ih 0.1 a 1. the above parameters shall be recorded before and after bur n - in and life test to determine the drift. 4.4.2 group c inspection . the group c inspection end - point electrical parameters shall be as specified in table ii herein. 4.4.2.1 additional criteria for device class m . steady - state life test conditions, method 1005 of mil - std - 883: a. test condition a, b, c, d or e. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test cir cuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil - std - 883. b. t a = +125 c, minimum. c. test duration: 1,000 hours, except as permitted by method 1005 of mil - std - 883.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 14 dscc form 2234 apr 97 4.4.2.2 additional criteria for device classes q and v . the steady - state life test duration, test condition and test temperature, or approved alternatives s hall be as specified in the device manufacturer's qm plan in accordance with mil - prf - 38535. the test circuit shall be maintained under document revision level control by the device manufacturer's trb in accordance with mil - prf - 38535 and shall be made ava ilable to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of mil - std - 883. 4.4.3 group d insp ection . the group d inspection end - point electrical parameters shall be as specified in table ii herein. 4.4.4 group e inspection . group e inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. end - point electrical parameters shall be as specified in table ii herein. b. for device classes q and v, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in mil - prf - 38535 for the rha level being tested. for device class m, the devices shall be subjected to radiation hardness assured tests as specified in mil - prf - 38535, appendix a for the rha level being tested. all device classes must meet the postirradiation end - point electrical parameter limits as defined in table i at t a = +25 c 5 c, after exposure, to the subgroups specified in table ii herein. c. when specified in the purchase order or contract, a copy of the rha delta limits shall be supplied. 5. packaging 5.1 packaging requirements . the requirements for packaging s hall be in accordance with mil - prf - 38535 for device classes q and v or mil - prf - 38535, appendix a for device class m. 6. notes 6.1 intended use . microcircuits conforming to this drawing are intended for use for government microcircuit applications (o riginal equipment), design applications, and logistics purposes. 6.1.1 replaceability . microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared specification or drawing. 6.1.2 substitutability . dev ice class q devices will replace device class m devices. 6.2 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination will be accomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users should inform defense supply center columbus when a system application requires configuration control and which smd's are applicable to that system. dscc wi ll maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronic devices (fsc 5962) should contact dscc - va, telephone (614) 692 - 0544.
standard microcircuit drawing size a 5962 - 03 a06 defense supply center columbus columbus, ohio 43216 - 5000 revision level sheet 15 dscc form 2234 apr 97 6.4 comments . comme nts on this drawing should be directed to dscc - va , columbus, ohio 43216 - 5000, or telephone (614) 692 - 0547. 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are defined in mil - prf - 38535 and mil - hdbk - 1331. 6.6 sources of supply . 6.6.1 sources of supply for device classes q and v . sources of supply for device classes q and v are listed in qml - 38535. the vendors listed in qml - 38535 have submitted a certificate of compliance (see 3.6 herein) to dsc c - va and have agreed to this drawing. 6.6.2 approved sources of supply for device class m . approved sources of supply for class m are listed in mil - hdbk - 103. the vendors listed in mil - hdbk - 103 have agreed to this drawing and a certificate of complianc e (see 3.6 herein) has been submitted to and accepted by dscc - va.
standard microcircuit drawing bulletin date: 03 - 08 - 11 approved sources of supply for smd 5962 - 03a06 are listed below for immediate acquisition information only and shall be added to mil - hdbk - 103 and qml - 38535 during the next revision. mil - hdbk - 103 and qml - 38535 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to an d accepted by dscc - va. this bulletin is superseded by the next dated revision of mil - hdbk - 103 and qml - 38535. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962 - 03a0601qxc f7400 AT7908Ejlmq 5962 - 03a0601vxc f7400 at790 8ejlrv 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / cautio n . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. vendor cage vendor name number and address f7400 atmel nantes sa bp 70602 44306 nantes cedex 3 france the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin.

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